SI 1210 Series Inductor Environment & Soldering Specifications


SI 1210 Series Inductor- WOUND CHIP INDUCTORS
RECOMMENDED SOLDERING CONDITIONS FOR REFLOW SOLDERING

MATERIALS

  • CORE TYPE: MNZN FERRITE DR TYPE CORE
  • WIRE : ENAMELLED COPPER WIRE
  • TERMINAL : TINNED COPPER FLAT LEADS
  • ENCAPSULATE : EPOXY NOVOLAC MOLDING COMPOUND

GENERAL CHARACTERISTICS

  • TEMPERATURE RISE : 20ºC MAX
  • AMBIENT OPERATING TEMP : 80ºC MAX
  • STORAGE TEMP : -40º ~ + 100ºC
  • OPERATING TEMP : -25ºC ~ +100ºC
  • TERMINAL STRENGTH : 0.5 KG MIN
  • RATED CURRENT : CURRENT THAT WILL CAUSE INDUCTANCE TO DROP WITHIN 10%
  • RESISTANCE TO SOLDER HEAT : 260ºC FOR 10 SECS
  • RESISTANCE TO SOLVENT : PER MIL-STD-202F
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